ENCAPSULATION WILL EXPOSE THE DIE IN ANY PLASTIC IC PACKAGE BY ETCHING AWAY THE DIE’S PLASTIC COVERING. THIS PROCESS WILL ALLOW US TO SEE IF THERE IS ACTUALLY A DIE INSIDE THE PACKAGE. DECAP WILL ALSO SHOW DIE TOPOGRAPHY, MANUFACTURER MARKINGS, COPYRIGHT DATE, PART NUMBER, CONSISTENCY IN DIE SIZE FROM DIFFERENT DATE CODES, AND BOND WIRES.