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Samsung first to introduce EUV for DRAM chips: to be used for DDR5/LPDDR5 mass production next year
3/26/2020
The EUV (Extreme Ultraviolet Lithography) process, currently the most advanced in chip manufacturing, has been pioneered by Samsung in the production of DRAM memory particles.
 
 
The Korean giant announced today that it has shipped one million first-generation 10nm EUV-class (D1x) DDR4 DRAM modules and completed global customer evaluations, opening new doors for future applications such as high-end PCs, mobile phones and enterprise servers.
 
Thanks to EUV technology, it is possible to reduce the repetitive steps of multiple patterning in more precise lithography and further increase throughput.
 
Samsung said it will fully introduce EUV from the fourth generation of 10nm-class (D1a) DRAM or high-end 14nm-class DRAM, and mass production of DDR5 and LPDDR5 memory chips based on D1a next year, which is expected to double the productivity of 12-inch wafers.
 
However, while DDR5-enabled PC platforms have yet to debut, LPDDR5 is gradually being rolled out. Samsung's mass production of the first generation EUV DDR5 DRAM single chip capacity of 16Gb (2GB), the location is the V2 line in Pyeongtaek City.
 
According to Samsung's previous prognosis, EUV will help the company advance to at least the 3nm scale.
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